ESD (electrostatic discharge) materials can reduce static electricity to protect static-sensitive equipment, flammable gases or liquids. Electrostatic discharge materials are usually divided into the following categories according to their characteristics: Anti-static, Conductive, and Dissipative.

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ESD (electrostatic discharge) materials

Material	Surface resistance (Ω/sq)	Characteristic
Conductive	103 to 105	Conductive materials have low resistance, so electrons can easily flow through the surface or inside of these materials. The charge will flow to the ground or another conductive object in contact with the material.
Static dissipation	105 to 109	Compared with conductive materials, static dissipative materials can make charge flow to the ground or other conductors in a more controlled and slow manner.
Anti-static	109 to 1012	Anti-static materials can inhibit friction and electricity generation.

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Semiconductor application of antistatic plastic sheet

During the entire chip manufacturing process, chip products (especially those with high integration or small size) and wafers are sensitive to static electricity and are easily damaged by static electricity from related equipment or tools.
Electrostatic adsorption of dust and contaminants reduces yield. Semiconductor lithography is particularly sensitive to dust. During the exposure process, any level of dust, whether on the wafer or on the shield, can cause die pattern failure. In the external production process, the surface of the wafer is contaminated with dust, which will affect the performance of the product.

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