ESD (electrostatic discharge) materials can reduce static electricity to protect static-sensitive equipment, flammable gases or liquids. Electrostatic discharge materials are usually divided into the following categories according to their characteristics: Anti-static, Conductive, and Dissipative.
ESD (electrostatic discharge) materials
|Conductive||103 to 105||Conductive materials have low resistance, so electrons can easily flow through the surface or inside of these materials. The charge will flow to the ground or another conductive object in contact with the material.|
|Static dissipation||105 to 109||Compared with conductive materials, static dissipative materials can make charge flow to the ground or other conductors in a more controlled and slow manner.|
|Anti-static||109 to 1012||Anti-static materials can inhibit friction and electricity generation.|
Semiconductor application of antistatic plastic sheet
During the entire chip manufacturing process, chip products (especially those with high integration or small size) and wafers are sensitive to static electricity and are easily damaged by static electricity from related equipment or tools.
Electrostatic adsorption of dust and contaminants reduces yield. Semiconductor lithography is particularly sensitive to dust. During the exposure process, any level of dust, whether on the wafer or on the shield, can cause die pattern failure. In the external production process, the surface of the wafer is contaminated with dust, which will affect the performance of the product.
Application of Antistatic Plastics
Antistatic plastic sheets are widely used in the production of wafer cassettes/carriers, reticle boxes, wafer combs, fixtures, trays, vacuum suction pens, etc.